Method of manufacturing a circuit board by punching
AssigneeDsm IP Assets B.V.
InventorsKoichi Kumai, Ryuji Ueda, Kentaro Kubota, Shigeki Kudo, Minoru Kawasaki
Life of this patent
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Abstract
A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.
Claims20
A method of manufacturing a back sheet for a back contact solar cell module comprising the steps of:
- a. providing a laminate comprising a metal foil adhered to a base material via an adhesive;
- b. pushing a first punching blade and a second punching blade into the metal to cut the metal foil into a retained portion and a removal portion;
- c. pushing a third punching blade into the removal portion of the metal to cut the removal portion of the metal foil;
- and
- d. separating the retained portion of the metal foil and the removal portion of the metal foil to remove the removal portion of the metal foil from the laminate.
Dependencies are inferred from the claim text.