Integrated circuit including interconnection and method of fabricating the same, the interconnection including a pattern shaped and/or a via disposed for mitigating electromigration

An integrated circuit comprising:

• a first conductive pattern in a first conductive layer, the first conductive pattern comprising:
• a first segment comprising at least one first point through which a first current is supplied from outside the first conductive pattern,
• a second segment comprising at least one second point through which a second current is drawn to outside the first conductive pattern, and
• a third segment connecting the first segment to the second segment;
• a second conductive pattern in a second conductive layer over the first conductive layer;
• and
• a via electrically connected with the first conductive pattern and the second conductive pattern to allow the first current to be supplied from the first conductive pattern through the via to the second conductive pattern and to allow the second current to be drawn from the second conductive pattern through the via to the first conductive pattern, the via being on the third segment of the first conductive pattern.