Low profile integrated package
AssigneeQUALCOMM Incorporated
InventorsKuiwon Kang, Houssam Jomaa, Christopher Bahr, Layal Rouhana
Life of this patent
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Abstract
A package that includes a substrate comprising an interposer interconnect and a cavity, a redistribution portion coupled to the substrate, the redistribution comprising a plurality of redistribution interconnects, and a first die coupled to the redistribution portion through the cavity of the substrate. A substantial region between a side surface of the first die and the substrate is free of an encapsulation layer. In some implementations, the substrate is free of a metal ring that surrounds the first die. In some implementations, the redistribution portion comprises a barrier layer and a first interconnect coupled to the barrier layer. The barrier layer is coupled to the interposer interconnect.
Claims29
A package comprising:
- a substrate comprising an interposer interconnect and a cavity;
- a redistribution portion coupled to the substrate, the redistribution portion comprising a plurality of redistribution interconnects, a barrier layer, and a first interconnect coupled to the barrier layer, the barrier layer coupled to the interposer interconnect of the substrate;
- a first die coupled to the redistribution portion through the cavity of the substrate such that a region between the first die and the redistribution portion is free of an underfill;
- and
- an encapsulation layer located over a backside of the first die such that a lateral region between a side surface of the first die and the substrate is at least fifty percent free of the encapsulation layer.
A package comprising:
- a substrate comprising an interposer interconnect and a cavity;
- a redistribution portion coupled to the substrate, the redistribution portion comprising a plurality of redistribution interconnects and a barrier layer,
- wherein the barrier layer is coupled to the interposer interconnect and a redistribution interconnect such that the barrier layer is located between the interposer interconnect and the redistribution interconnect, and
- wherein the barrier layer comprises a different material than the redistribution interconnect;
- and
- a first die coupled to the redistribution portion through the cavity of the substrate.
An apparatus comprising:
- means for substrate comprising an interposer interconnect and a cavity;
- means for redistribution coupled to the means for substrate, the means for redistribution comprising a plurality of redistribution interconnects, a barrier layer, and a first interconnect coupled to the barrier layer, the barrier layer coupled to the interposer interconnect of the substrate;
- a first die coupled to the means for redistribution through the cavity of the means for substrate such that a region between the first die and the means for redistribution is free of an underfill;
- and
- an encapsulation layer located over a backside of the first die such that a lateral region between a side surface of the first die and the means for substrate is at least fifty percent free of the means for encapsulation.
An apparatus comprising:
- means for substrate comprising an interposer interconnect and a cavity;
- means for redistribution coupled to the means for substrate, the means for redistribution comprising a plurality of redistribution interconnects and a means for barrier, wherein the means for barrier is coupled to the interposer interconnect and a redistribution interconnect such that the means for barrier is located between the interposer interconnect and the redistribution interconnect;
- and
- a first die coupled to the means for redistribution through the cavity of the means for substrate such that a region between the first die and the means for redistribution is free of an underfill, wherein the first die is coupled to the means for redistribution such that a front side of the first die faces the means for redistribution.
Dependencies are inferred from the claim text.