Multichip module including surface mounting part embedded therein

An on board computer comprising:

• a multichip module arranged on a mount substrate;
• and
• an interface configured to carry out input and output of data of the multichip module,
• wherein the multichip module comprises:
• a plurality of semiconductor substrates, each having a wiring line region in which a wiring line passes through the semiconductor substrate from one surface toward another surface;
• and
• a plurality of surface mounting parts mounted on any of the plurality of semiconductor substrates,
• wherein the plurality of semiconductor substrates are stacked and bonded without gaps between the plurality of semiconductor substrates in a first direction to form a multilayer structure, and
• a first surface mounting part as at least one of the plurality of surface mounting parts is arranged in an inner space of the multilayer structure,
• wherein the plurality of semiconductor substrates comprises:
• a first semiconductor substrate on which the first surface mounting part is mounted;
• a second semiconductor substrate stacked on the first semiconductor substrate and having 1) a first surface, 2) a second surface, and 3) a penetrating hole which reaches the first surface from the second surface in the first direction;
• and
• a third semiconductor substrate stacked over the first semiconductor substrate and the second semiconductor substrate,
• wherein the inner space is arranged between the first semiconductor substrate and the third semiconductor substrate in the first direction and includes the penetrating hole of the second semiconductor substrate,
• wherein a second surface mounting part as at least one of the plurality of surface mounting parts is arranged in the inner space together with the first surface mounting part, and
• wherein the inner space starts from a surface of the first semiconductor substrate on which the first surface mounting part and the second semiconductor substrate are connected and ends on a surface of the third semiconductor substrate.

An interface substrate comprising:

• a multichip module arranged on a mount substrate;
• and
• an interface configured to carry out input and output of data of the multichip module,
• wherein the multichip module comprises:
• a plurality of semiconductor substrates, each having a wiring line region in which a wiring line passes through the semiconductor substrate from one surface toward another surface;
• and
• a plurality of surface mounting parts mounted on any of the plurality of semiconductor substrates,
• wherein the plurality of semiconductor substrates are stacked and bonded without gaps between the plurality of semiconductor substrates in a first direction to form a multilayer structure, and
• a first surface mounting part as at least one of the plurality of surface mounting parts is arranged in an inner space of the multilayer structure,
• wherein the plurality of semiconductor substrates comprises:
• a first semiconductor substrate on which the first surface mounting part is mounted;
• a second semiconductor substrate stacked on the first semiconductor substrate having 1) a first surface, 2) a second surface, and 3) a penetrating hole which reaches the first surface from the second surface in the first direction;
• and
• a third semiconductor substrate stacked over the first semiconductor substrate and the second semiconductor substrate,
• wherein the inner space is arranged between the first semiconductor substrate and the third semiconductor substrate in the first direction and includes the penetrating hole of the second semiconductor substrate,
• the plurality of surface mounting parts comprises an ASIC (Application Specific Integrated Circuit) or a sensor,
• wherein a second surface mounting part as at least one of the plurality of surface mounting parts is arranged in the inner space together with the first surface mounting part, and
• wherein the inner space starts from a surface of the first semiconductor substrate on which the first surface mounting part and the second semiconductor substrate are connected and ends on a surface of the third semiconductor substrate.

A method of manufacturing a multichip module, comprising:

• preparing a first semiconductor substrate, a second semiconductor substrate and a third semiconductor substrate, each having a wiring line region which contains a wiring line to pass from one of the surfaces to the other surface;
• stacking and bonding the second semiconductor substrate on the first semiconductor substrate without gaps between the second semiconductor substrate and the first semiconductor substrate, in a first direction, by a room-temperature bonding method;
• mounting a first surface mounting part on a part of the first semiconductor substrate which is not covered with the second semiconductor substrate;
• and
• stacking and bonding the third semiconductor substrate on the second semiconductor substrate without gaps between the third semiconductor substrate and the second semiconductor substrate, in the first direction, by a room-temperature bonding method to cover the first surface mounting part,
• wherein the preparing the second semiconductor substrate comprises:
• forming a penetrating hole which reaches a first surface of the second semiconductor substrate from the second surface of the second semiconductor substrate in the first direction,
• wherein an inner space is arranged between the first semiconductor substrate and the third semiconductor substrate in the first direction and includes the penetrating hole of the second semiconductor substrate,
• wherein a second surface mounting part as at least one of the plurality of surface mounting parts is arranged in the inner space together with the first surface mounting part, and
• wherein the inner space starts from a surface of the first semiconductor substrate on which the first surface mounting part and the second semiconductor substrate are connected and ends on a surface of the third semiconductor substrate.