Staggered die stacking across heterogeneous modules
AssigneeIntel Corporation
InventorYen Hsiang Chew
Life of this patent
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Abstract
An electronic package can include a substrate, a first die and a second die. The first die can include a first thickness and the second die can include a second thickness. The first and second dies can be coupled to the substrate. A mold can be disposed on the substrate and cover the first die and the second die. The mold can include a planar upper surface. A first via, having a first length, can be extended between the first die and the planar upper surface. A second via, having a second length, can be extended between the second die and the planar upper surface. In some examples, a third die can be communicatively coupled to the first die using the first via and the second die using the second via.
Claims13
An electronic package comprising:
- a substrate;
- a first die directly electrically connected to conductive routing in the substrate through a first active surface of the first die facing the substrate, the first die having a first thickness;
- a second die directly electrically connected to conductive routing in the substrate through a second active surface of the second die facing the substrate, the second die having a second thickness;
- a mold disposed on the substrate and in contact with and covering a third surface of the first die facing away from the first active surface and a fourth surface of the second die facing away from the second active surface, the mold includes a planar upper surface;
- a first via having a first length extended between the first active surface and through the mold to the planar upper surface;
- a second via having a second length extended between the second active surface and through the mold to the planar upper surface;
- a third die attached to the upper surface and communicatively coupled to the first die by the first via and the second die by the second via;
- and
- an interconnect bridge situated in the substrate and directly electrically connected to the first die and the second die through respective electrical interconnects connected to the first active surface and the second active surface.
An electronic package comprising:
- a substrate;
- a first die directly electrically connected to conductive routing in the substrate through a first surface of the first die facing the substrate, the first die having a first thickness;
- a second die directly electrically connected to conductive routing in the substrate through a second surface of the second die facing the substrate, the second die having a second thickness different than the first thickness;
- a mold disposed on the substrate and covering the first die and the second die, the mold includes a planar upper surface;
- a first through silicon via having a die portion located within the first die and a mold portion having a first length extended between the first die and the planar upper surface;
- a second through silicon via having a die portion located within the second die and a mold portion having a second length extended between the second die and the planar upper surface, wherein the second length is different than the first length;
- a third die attached to the upper surface and communicatively coupled to the first die by the first via and the second die by the second via;
- and
- an interconnect bridge situated in the substrate and directly electrically connected to the first die and the second die through respective electrical interconnects connected to the first surface and the second surface.
Dependencies are inferred from the claim text.