Semiconductor device and method of forming wafer level ground plane and power ring

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• depositing an encapsulant around the semiconductor die;
• forming a conductive plane in a center region over a first surface of the semiconductor die;
• forming a conductive ring around the conductive plane over the first surface of the semiconductor die;
• forming a first conductive layer over the first surface of the semiconductor die and coupled to the conductive plane;
• and
• forming a plurality of conductive vias through the encapsulant around the semiconductor die.

A semiconductor device, comprising:

• a semiconductor die;
• an encapsulant deposited around the semiconductor die;
• a conductive plane formed in a center region over a first surface of the semiconductor die;
• a conductive ring formed around the conductive plane over the first surface of the semiconductor die;
• and
• a plurality of conductive vias formed through the encapsulant around the semiconductor die.

A semiconductor device, comprising:

• a semiconductor die;
• an encapsulant deposited around the semiconductor die;
• a conductive plane formed over a first surface of the semiconductor die;
• a conductive ring formed around the conductive plane over the first surface of the semiconductor die;
• and
• a plurality of conductive vias formed through the encapsulant around the semiconductor die.