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US 10,651,137 B2Granted
Manufacturing method of a package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Kuo-Chung Yee
Life of this patent
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Abstract
A method of manufacturing a package structure is provided with the following steps, providing a first die, a second die and a third die; forming a first redistribution layer located on and electrically coupled to the first die, the second die and the third die; and forming an antenna located on and electrically coupled to the first die, the second die and the third die, wherein a distance of an electrical connection path between the first die and the antenna is smaller than or equal to a distance of an electrical connection path between the second die and the antenna and a distance of an electrical connection path between the third die and the antenna.
Claims20
A manufacturing method of a package structure, comprising:
- providing a first die, a second die and a third die;
- forming a first redistribution layer located on and electrically coupled to the first die, the second die and the third die;
- and
- forming an antenna having a first metallic portion and a second metallic portion located on and electrically coupled to the first die, the second die and the third die, the second metallic portion being mechanically separated from the first metallic portion, and the first metallic portion and the second metallic portion working together in a manner of electrical coupling,
- wherein a distance of an electrical connection path between the first die and the antenna is smaller than or equal to a distance of an electrical connection path between the second die and the antenna and a distance of an electrical connection path between the third die and the antenna.
2 more elements
A manufacturing method of a package structure, comprising:
- providing a first die, a second die and a third die;
- encapsulating the first die, the second die and the third die in a molding compound;
- forming a first redistribution layer on the molding compound, wherein the first redistribution layer is electrically connected to the first die, the second die and the third die;
- forming an antenna having a first metallic portion and a second metallic portion on the molding compound, the second metallic portion being mechanically separated from the first metallic portion, and the first metallic portion and the second metallic portion working together in a manner of electrical coupling, wherein the antenna is electrically connected to the first die, the second die and the third die, and a distance of an electrical connection path between the first die and the antenna is smaller than or equal to a distance of an electrical connection path between the second die and the antenna and a distance of an electrical connection path between the third die and the antenna;
- and
- disposing conductive elements on the first redistribution layer, wherein the first redistribution layer is located between the molding compound and the conductive elements.
3 more elements
A manufacturing method of a package structure, comprising:
- forming a sub-package, comprising:
- disposing a first die, a second die and a third die on a carrier;
- encapsulating the first die, the second die and the third die in a molding compound;
- forming a first redistribution layer on the molding compound, wherein the first redistribution layer is electrically connected to the first die, the second die and the third die, and the molding compound is located between the first redistribution layer and the carrier;
- forming a second redistribution layer on the carrier, wherein the second redistribution layer is between the molding compound and the carrier;
- forming at least one through interlayer via on the second redistribution layer and encapsulated in the molding compound, wherein the at least one through interlayer via is electrically connected to the first redistribution layer and the second redistribution layer;
- disposing conductive elements on the first redistribution layer, wherein the first redistribution layer is located between the molding compound and the conductive elements;
- and
- debonding the carrier;
- providing an antenna package having a first metallic portion and a second metallic portion mechanically separated from the first metallic portion, and the first metallic portion and the second metallic portion working together in a manner of electrical coupling;
- and
- mounting the antenna package onto the second redistribution layer of the sub-package, wherein the antenna package is electrically connected to the second redistribution layer and is electrically connected to the first die, the second die and the third die, and a distance of an electrical connection path between the first die and the antenna package is smaller than or equal to a distance of an electrical connection path between the second die and the antenna package and a distance of an electrical connection path between the third die and the antenna package.
9 more elements
Dependencies are inferred from the claim text.