Semiconductor device

A semiconductor device comprising:

• a wiring board;
• a first semiconductor chip that is fixed to the wiring board and includes a first surface film on a front surface thereof;
• a second semiconductor chip including a second surface film on a front surface thereof and positioned such that the first semiconductor chip is between the second semiconductor chip and the wiring board;
• a supporting plate between the first semiconductor chip and the second semiconductor chip, the supporting plate having a first surface and having a second surface on a side opposite to the first surface, the second surface facing the first semiconductor chip, wherein the supporting plate supports the second semiconductor chip in a region on a side where the first surface is located;
• a front surface layer on the first surface in a region between the first and second semiconductor chips and formed of a same material as the second surface film;
• a spacer between the wiring board and the supporting plate;
• and
• a sealing resin that covers the second semiconductor chip and the supporting plate and that contacts the second surface film and contacts a front surface of the front surface layer that is opposite to a rear surface of the front surface layer facing the supporting plate.