Supporting InFO packages to reduce warpage
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJie Chen, Ying-Ju Chen, Hsien-Wei Chen
Life of this patent
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Abstract
A method includes encapsulating a first device die and a second device die in an encapsulating material, forming redistribution lines over and electrically coupling to the first device die and the second device die, and bonding a bridge die over the redistribution lines to form a package, with the package including the first device die, the second device die, and the bridge die. The bridge die electrically inter-couples the first device die and the second device die. The first device die, the second device die, and the bridge die are supported with a dummy support die.
Claims20
A method comprising:
- encapsulating a first device die and a second device die in an encapsulating material;
- forming redistribution lines over the first device die and the second device die;
- forming electrical connectors overlying and electrically coupling to the first device die and the second device die through the redistribution lines;
- performing a singulation on the encapsulating material, wherein the first device die and the second device die are sawed into a package;
- and
- attaching the package to a dummy support die, wherein the dummy support die extends beyond edges of the package in each of four lateral directions.
A method comprising:
- adhering a blank die to a package through an adhesive film, wherein the package comprises:
- a first device die;
- a second device die;
- an encapsulating material encapsulating the first device die and the second device die therein, wherein opposite sides of the adhesive film are in physical contact with the encapsulating material and the blank die;
- and
- a plurality of redistribution lines over and electrically coupling to the first device die and the second device die;
- and
- bonding a package component to the package, wherein the blank die and the package component are located on opposite sides of the package.
A method comprising:
- encapsulating a first device die and a second device die in an encapsulating material;
- forming redistribution lines over the first device die and the second device die;
- forming electrical connectors overlying and electrically coupling to the first device die and the second device die through the redistribution lines;
- performing a singulation on the encapsulating material, wherein the first device die and the second device die are sawed into a package;
- and
- attaching the package to a dummy support die, wherein in a top view of the package, the package is elongated and comprises a long edge and a short edge perpendicular to, and shorter than, the long edge, and the dummy support die extends beyond the short edge, and has edges flush with the long edge.
Dependencies are inferred from the claim text.