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US 10,651,128 B2Granted
Electronic devices with yielding substrates
AssigneeCooledge Lighting Inc.
InventorsMichael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
Life of this patent
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Abstract
In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.
Claims24
A method of forming an electronic device, the method comprising:
- providing a yielding substrate having at least three conductive traces on a first surface thereof in a bonding region, the at least three conductive traces being separated on the substrate by gaps therebetween;
- and
- with a pressure-activated adhesive material, adhering each of at least three contacts of a light-emitting element (LEE) to a different one of the at least three traces by applying pressure to at least one of the yielding substrate or the LEE, thereby establishing electrical connection between the contacts and the traces but without electrically bridging the traces or the contacts.
Dependencies are inferred from the claim text.