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US 10,651,127 B2Granted
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same
AssigneeIntel Corporation
InventorsJackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi, Paik Wen Ong
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Abstract
Ring-in-ring stiffeners on a semiconductor package substrate includes a passive device that is seated across the ring stiffeners. The ring-in-ring stiffeners are also electrically coupled to traces in the semiconductor package substrate through electrically conductive adhesive that bonds a given ring stiffener to the semiconductor package substrate. The passive device is embedded between the two ring stiffeners to create a smaller X-Y footprint as well as a lower Z-direction profile.
Claims7
A semiconductor package, comprising:
- a package substrate including a die side and a land side;
- an inner ring stiffener and a subsequent ring stiffener disposed adjacent the inner ring stiffener,
- wherein each ring stiffener is seated on the die side with an electrically conductive adhesive, and wherein at least one electrically conductive adhesive is coupled to a trace within the package substrate;
- a passive device electrically contacting the inner ring stiffener and the subsequent ring stiffener,
- wherein the subsequent ring stiffener is coupled to ground and the inner ring stiffener is coupled to a power connection, wherein the passive device is an inner passive device, further including:
- an outer ring stiffener, wherein the subsequent ring stiffener is disposed on the die side between the inner ring stiffener and the outer ring stiffener;
- and
- at least one outer passive device electrically contacting the outer ring stiffener and the subsequent ring stiffener, wherein the outer ring stiffener is coupled to power connections.
5 more elements
Dependencies are inferred from the claim text.