Methods and apparatus for wafer-level die bridge
AssigneeApplied Materials, Inc.
InventorsChien-Kang Hsiung, Arvind Sundarrajan
Life of this patent
Estimating the term…
Abstract
A wafer-level bridge die is affixed with an adhesive layer to a redistribution layer (RDL) that has been temporarily bonded to a carrier. Electrical interconnects are formed on the RDL and on the bridge die and encapsulated in a first mold layer. A plurality of dies are coupled to the RDL and the bridge die such that a die is electrically connected to at least one electrical interconnect of the RDL and to at least one electrical interconnect of the bridge die. A second mold layer is formed on the first mold layer to encapsulate the plurality of dies. The temporary bond is then broken and the carrier is removed, exposing the RDL connections.
Claims10
A method of forming a wafer level bridge die, comprising:
- forming a redistribution layer (RDL);
- affixing a bridge die on the RDL, the bridge die having electrical connections on an exposed surface opposite of the RDL;
- forming at least one electrical interconnect on the RDL;
- forming at least one electrical interconnect on the bridge die;
- forming at least one first portion of at least one through mold via (TMV) on the RDL;
- forming a first mold layer over the RDL and the bridge die;
- forming at least one second portion of the at least one TMV;
- coupling a plurality of dies to the RDL and to the bridge die such that a die is electrically connected to at least one electrical interconnect of the RDL and to at least one electrical interconnect of the bridge die;
- and
- forming a second mold layer on the first mold layer and on the plurality of dies, the at least one TMV having an electrical connection at a top surface of the second mold layer for supporting package-on-package (PoP) electrical connections.
A method of forming a wafer level bridge die, comprising:
- temporarily bonding a redistribution layer (RDL) on a carrier;
- affixing a bridge die on the RDL, the bridge die having electrical connections on an exposed surface opposite of the RDL;
- forming at least one electrical interconnect on the RDL;
- forming at least one electrical interconnect on the exposed surface of the bridge die;
- forming a first mold layer on the RDL and the bridge die;
- coupling a plurality of dies to the RDL and to the bridge die such that a die is electrically connected to at least one electrical interconnect of the RDL and to at least one electrical interconnect of the bridge die;
- forming a second mold layer on the first mold layer and on the plurality of dies;
- removing the carrier from the RDL;
- and
- forming at least one through mold via from the RDL to a top surface of the second mold layer.
Dependencies are inferred from the claim text.