Planar integrated circuit package interconnects
AssigneeIntel Corporation
InventorsRobert L. Sankman, Sanka Ganesan
Life of this patent
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Abstract
Generally discussed herein are systems, methods, and apparatuses that include conductive pillars that are about co-planar. According to an example, a technique can include growing conductive pillars on respective exposed landing pads of a substrate, situating molding material around and on the grown conductive pillars, removing, simultaneously, a portion of the grown conductive pillars and the molding material to make the grown conductive pillars and the molding material about planar, and electrically coupling a die to the conductive pillars.
Claims20
A method of making an integrated circuit package comprising:
- growing conductive pillars on respective landing pads of a substrate to make grown conductive pillars directly electrically and mechanically contact the landing pads;
- situating molding material around and on the grown conductive pillars;
- removing, simultaneously, a portion of the grown conductive pillars and the molding material to make top surfaces of the grown conductive pillars within five micrometers of planar with respect to one another;
- and
- electrically coupling a die to the conductive pillars.
An integrated circuit (IC) package comprising:
- a substrate comprising interconnect circuitry embedded in buildup layers and a plurality of landing pads exposed at a top surface of the substrate;
- a plurality of conductive pillars electrically connected to respective landing pads;
- a molding material around at least a portion of respective sidewalls of respective conductive pillars and on the substrate, the plurality of conductive pillars recessed in the molding material;
- and
- a die on the substrate, the die including contact pads electrically coupled to the interconnect circuitry through the conductive pillars;
- wherein the conductive pillars each include top surfaces that are planar with respect to one another to within a five micron deviation.
A method of making an integrated circuit package comprising:
- growing copper pillars directly on respective landing pads of a substrate;
- situating molding material around and on the grown copper pillars;
- removing, simultaneously, a portion of the grown copper pillars and the molding material to make the grown copper pillars planar with respect to each other to within a five micron deviation;
- and
- reflowing solder balls to electrically couple contact pads of the die to the copper pillars and to interconnect circuitry of the substrate.
Dependencies are inferred from the claim text.