Thermal management of RF devices using embedded microjet arrays

An assembly, comprising:

• a semiconductor component, formed on a semiconductor substrate, and having a heat generating device disposed therein, wherein one surface of the semiconductor substrate is referred to as an impingement surface;
• a jet plate, directly bonded to the impingement surface of the semiconductor component, where a reservoir is formed within the assembly as a sealed enclosure bounded by the jet plate and the impingement surface of the semiconductor component,
• wherein the jet plate comprising a microjet and an exhaust port in communication with the reservoir;
• and
• an effluent control feature, which extends from the jet plate to the impingement surface and directs flow of effluent toward the exhaust port.

A method of cooling a semiconductor component formed on a semiconductor substrate, wherein one surface of the semiconductor substrate is referred to as an impingement surface, comprising:

• directing a single-phase coolant fluid through a plurality of microjets toward a surface of the semiconductor component such that the single-phase coolant fluid strikes the impingement surface of the semiconductor component;
• controlling a flow of effluent toward an exhaust port;
• and
• exhausting the single-phase coolant fluid through the exhaust port away from the semiconductor component after the single-phase coolant fluid strikes the impingement surface.

A method of cooling a semiconductor component formed on a semiconductor substrate, wherein one surface of the semiconductor substrate is referred to as an impingement surface, comprising:

• directing a single-phase coolant fluid through a plurality of microjets toward a surface of the semiconductor component such that the single-phase coolant fluid strikes the impingement surface of the semiconductor component;
• improving heat transfer properties by increasing a surface area of the impingement surface to increase contact between the semiconductor component and the single-phase coolant fluid;
• and
• exhausting the single-phase coolant fluid through an exhaust port away from the semiconductor component after the single-phase coolant fluid strikes the impingement surface.

A method of cooling a semiconductor component formed on a semiconductor substrate, wherein one surface of the semiconductor substrate is referred to as an impingement surface, comprising:

• directing a single-phase coolant fluid through a plurality of microjets toward a surface of the semiconductor component such that the single-phase coolant fluid strikes the impingement surface of the semiconductor component;
• improving heat transfer properties by providing wall jet features that extend perpendicular to the impingement surface to increase single-phase heat transfer by boundary layer suppression and also increase contact area;
• and
• exhausting the single-phase coolant fluid through an exhaust port away from the semiconductor component after the single-phase coolant fluid strikes the impingement surface.