Foam composite

An electronic assembly comprising:

• an electronics package including a heat dissipation surface;
• a heat sink;
• and a thermally conductive foam compressed between the heat dissipation surface and the heat sink, wherein the thermally conductive foam includes:
• a plurality of pores disposed within the thermally conductive foam, wherein the thermally conductive foam is greater than fifty-percent copper and compressible between an uncompressed thickness and a compressed thickness, a filler disposed in the pores of the thermally conductive foam, wherein the filler includes a first thermal conductivity, the first thermal conductivity is greater than a thermal conductivity of air;
• and a plurality of thermally conductive particles disposed within the filler, wherein the thermally conductive particles have a second thermal conductivity greater than the first thermal conductivity of the filler;
• and the filler is a phase change material that adapted to transition between phases within a temperature range of −40° C. to 125° C.;
• a continuous path of substantially homogeneous thermally conductive material disposed between a first side and a second side of the thermally conductive foam.

A method comprising:

• inserting a thermally conductive foam between an electronic package and a heat sink;
• wherein the thermally conductive foam is greater than fifty-percent copper and compressible between an uncompressed thickness and a compressed thickness, a first side of the thermally conductive foam interfaced with a dissipation surface of the electronic package, and a second side of the thermally conductive foam interfaced with the heat sink, wherein the thermally conductive foam includes pores disposed within the thermally conductive foam;
• and compressing the thermally conductive foam between the electronic package and the heatsink by at least five percent of a thickness of the thermally conductive foam;
• filling a plurality of pores with a filler, the plurality of pores disposed within a thermally conductive foam, wherein the filler includes a first thermal conductivity greater than a thermal conductivity of air;
• and a plurality of thermally conductive particles disposed within the filler, wherein the thermally conductive particles have a second thermal conductivity greater than the first thermal conductivity of the filler;
• and the filler is a phase change material that adapted to transition between phases within a temperature range of −40° C. to 125° C., and the thermally conductive foam is compressible between an uncompressed thickness and a compressed thickness, the compressed thickness being ninety-five percent or less of the uncompressed thickness.