Semiconductor device and method for fabricating the same
AssigneeElectronics and Telecommunications Research Institute
InventorsHyung Seok Lee, Zin-Sig Kim, Sung-Bum Bae
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Abstract
Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes a heat dissipation plate including a first region and a second region, a first element disposed on the heat dissipation plate in the first region, and a second element disposed on the heat dissipation plate in the second region. The first element includes a first substrate, the second element includes a second substrate, the first substrate includes a material different from a material of the second substrate, the first substrate contacts the heat dissipation plate, and the second element is bonded to the heat dissipation plate in a flip-chip bonding manner.
Claims10
A semiconductor device comprising:
- a heat dissipation plate comprising a first region and a second region;
- a first element disposed on the heat dissipation plate in the first region;
- and
- a second element disposed on the heat dissipation plate in the second region,
- wherein the first element comprises a first substrate,
- the second element comprises a second substrate,
- the first substrate comprises a material different from a material of the second substrate,
- the first substrate contacts the heat dissipation plate, and
- the second element is bonded directly to the heat dissipation plate by a flip-chip bonding manner.
Dependencies are inferred from the claim text.