Environmental protection for wafer level and package level applications
AssigneeQorvo US, Inc.
InventorsChristo Bojkov, Andrew Ketterson, Robert Charles Dry
Life of this patent
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Abstract
A method includes the steps of fabricating one or more semiconductor devices on a semiconductor wafer and depositing one or more conformal organic environmental protection layers over the semiconductor wafer using a vapor deposition process. By depositing the one or more conformal organic environmental protection layers using a vapor deposition process, thin film conformal organic environmental protection layers may be provided that offer excellent protection against water and oxygen ingress, thus increasing the ruggedness and reliability of the resulting semiconductor die.
Claims19
A method comprising:
- fabricating one or more semiconductor devices on a first surface of a semiconductor wafer;
- depositing at least one conformal organic environmental protection layer over the first surface of the semiconductor wafer to directly cover the one or more semiconductor devices using a vapor deposition process, wherein the at least one conformal organic environmental protection layer and the one or more semiconductor devices are located on a same side of the first surface of the semiconductor wafer;
- and
- patterning the at least one conformal organic environmental protection layer, which has a thickness less than 10000 Å, to expose one or more underlying layers.
A method comprising:
- providing a package base with a first surface;
- mounting at least one semiconductor die on the first surface of the package base to form an integrated circuit package;
- depositing at least one conformal organic environmental protection layer over the integrated circuit package to directly cover the at least one semiconductor die using a vapor deposition process, wherein the at least one conformal organic environmental protection layer and the at least one semiconductor die are located on a same side of the first surface of the package base;
- and
- patterning the at least one conformal organic environmental protection layer, which has a thickness less than 10000 Å to expose one or more underlying layers.
Dependencies are inferred from the claim text.