Interposer with conductive routing exposed on sidewalls

An electronic assembly, comprising:

• a substrate;
• and
• an interposer that includes a body having upper and lower surfaces and side walls extending between the upper and lower surfaces, the interposer further including conductive routings that are exposed on at least one of the side walls, wherein the substrate is electrically connected directly to the conductive routings that are exposed on at least one of the side walls, wherein the conductive routings are exposed from the body on each side wall of the interposer and on the upper and lower surfaces of the interposer, wherein the substrate includes a cavity, and the interposer is within the cavity, wherein the interposer is secured to a bottom of the cavity with solder balls, wherein the cavity includes sidewalls and the substrate includes conductive traces that are exposed from the sidewalls of the cavity, wherein the conductive traces that are exposed from the sidewalls of the cavity are electrically connected directly to the conductive routings that are exposed on at least one of the side walls of the interposer, wherein each of the side walls of the interposer is at a first angle other than 90 degrees relative to the upper surface and the lower surface of the body, wherein each of the side walls of the cavity is at a second angle that is the same as the first angle relative to an upper and lower surface of the substrate;
• and
• a plurality of solder caps that physically connect at least some of the conductive traces in the substrate to at least some of the conductive routings on the interposer.