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US 10,651,101 B2Granted
Electronic package with a local slot forming an air-vent
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorMarika Sorrieul
Life of this patent
Estimating the term…
Abstract
A support plate has a front face with an electronic chip mounted on the front face. A cover for encapsulating the electronic chip includes a front wall extending in front of the electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate. The support plate and the encapsulating cover define a chamber in which the electronic chip is located. A local slot is arranged to extend between the peripheral wall of the encapsulating cover and the support plate. The local slot has an exterior opening and an interior opening leading into said chamber.
Claims38
A package, comprising:
- a support plate having a front face;
- at least one electronic chip mounted on the front face of the support plate;
- a cover which encapsulates the at least one electronic chip, said cover comprising a front wall extending in front of the at least one electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate, wherein the support plate and the cover define a chamber in which the at least one electronic chip is located;
- at least one local slot arranged between the peripheral wall of the cover and the support plate and having an exterior opening and an interior opening leading into said chamber, said at least one local slot connecting said chamber and an exterior;
- and
- a fixing glue bead inserted between the end edge of the peripheral wall of the cover and said peripheral area of the support plate, wherein the fixing glue bead has a local break including said at least one local slot.
3 more elements
A package, comprising:
- a support plate having a front face;
- a local slot having an internal end and an external end;
- an electronic chip mounted on the front face of the support plate;
- a bead of glue that peripherally surrounds the electronic chip, said bead of glue including a squashed portion and an un-squashed portion;
- a cover which encapsulates the electronic chip, said cover comprising a front wall extending in front of the electronic chip and a peripheral wall having an end edge fixed to the front face of the support plate via the squashed portion of the bead of glue, said peripheral wall passing over said local slot at a position between the internal end and the external end of the local slot;
- and
- wherein the un-squashed portion of the bead of glue is positioned between an edge of the electronic chip and the internal end of the local slot.
4 more elements
A package, comprising:
- a support plate having a front face;
- at least one electronic chip mounted on the front face of the support plate;
- a cover which encapsulates the at least one electronic chip, said cover comprising a front wall extending in front of the at least one electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate, wherein the support plate and the cover define a chamber in which the at least one electronic chip is located;
- and
- a local slot arranged between the peripheral wall of the cover and the support plate and having an exterior opening and an interior opening leading into said chamber, said local slot connecting said chamber and an exterior, wherein said local slot includes a local groove arranged in the end edge of the peripheral wall of the cover;
- an interior divider located between the at least one electronic chip and the interior opening of said local slot;
- and
- a fixing glue bead inserted between the end edge of the peripheral wall of the cover and said peripheral area of the support plate, wherein the fixing glue bead has a local break including said local slot.
5 more elements
A package, comprising:
- a support plate having a front face;
- at least one electronic chip mounted on the front face of the support plate;
- a cover which encapsulates the at least one electronic chip, said cover comprising a front wall extending in front of the at least one electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate, wherein the support plate and the cover define a chamber in which the at least one electronic chip is located;
- and
- at least one local slot arranged between the peripheral wall of the cover and the support plate and having an exterior opening and an interior opening leading into said chamber, said at least one local slot connecting said chamber and an exterior;
- wherein said at least one local slot includes a local groove arranged in the front face of the support plate.
3 more elements
A package, comprising:
- a support plate having a front face;
- at least one electronic chip mounted on the front face of the support plate;
- a cover which encapsulates the at least one electronic chip, said cover comprising a front wall extending in front of the at least one electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate, wherein the support plate and the cover define a chamber in which the at least one electronic chip is located;
- and
- a local slot arranged between the peripheral wall of the cover and the support plate and having an exterior opening and an interior opening leading into said chamber, said local slot connecting said chamber and an exterior, wherein said local slot includes a local groove arranged in the end edge of the peripheral wall of the cover and in the front face of the support plate;
- and
- an interior divider located between the at least one electronic chip and the interior opening of said local slot.
4 more elements
Dependencies are inferred from the claim text.