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US 10,651,095 B2Granted
Thermal profile monitoring wafer and methods of monitoring temperature
AssigneeApplied Materials, Inc.
InventorDeepak Jadhav
Life of this patent
Estimating the term…
Abstract
Thermal monitors comprising a substrate with at least one camera position on a bottom surface thereof, a wireless communication controller and a battery. The camera has a field of view sufficient to produce an image of at least a portion of a wafer support, the image representative of the temperature within the field of view. Methods of using the thermal monitors are also described.
Claims8
A method of monitoring temperature of a wafer support in a processing chamber, the method comprising:
- positioning a thermal monitor on a plurality of lift pins, the thermal monitor having a substrate with at least one camera, a wireless communication controller and a battery, the at least one camera positioned on a bottom surface of the substrate and having a field of view, the battery connected to the at least one camera and the wireless communication controller, the plurality of lift pins supporting the thermal monitor so that there is a gap between the wafer support and the bottom surface of the thermal monitor;
- and
- measuring the temperature of the wafer support using the at least one camera on the thermal monitor.
Dependencies are inferred from the claim text.