Substrate processing apparatus and method of manufacture using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsKyoung Hwan Kim, Taewoo Kang, Byung Lyul Park, Hyungjun Jeon
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AssigneeSamsung Electronics Co., Ltd.
InventorsKyoung Hwan Kim, Taewoo Kang, Byung Lyul Park, Hyungjun Jeon
Estimating the term…
A substrate processing apparatus may include a substrate jig device and a transfer unit, which is configured to hold a substrate in a non-contact state and move the substrate toward the substrate jig device. The substrate jig device may include a supporter, which is configured to support an edge of the substrate and have an opening, a first suction part, which overlaps with a center region of the opening and is configured to move in a first direction, and a plurality of second suction parts, which overlap with an edge region of the opening and are configured to move toward the opening. Here, the first direction may be a direction passing through the opening.
A substrate processing apparatus, comprising:
A substrate processing apparatus, comprising:
Dependencies are inferred from the claim text.