Wafer composite and method for producing semiconductor components
AssigneeInfineon Technologies AG
InventorsRudolf Berger, Wolfgang Lehnert, Gerhard Metzger-Brueckl, Guenther Ruhl, Roland Rupp
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Abstract
This application relates to a method for producing a semiconductor component, in which a wafer composite is provided. The wafer composite includes a donor substrate, an auxiliary substrate and a separation layer arranged between the auxiliary substrate and the donor substrate. The separation layer has a support structure and sacrificial material, which is formed laterally between elements of the support structure. The auxiliary substrate is separated from the donor substrate. The separation includes a selective removal of the sacrificial material in relation to the support structure.
Claims28
A method for producing a semiconductor component, including:
- providing a wafer composite comprising a donor substrate, an auxiliary substrate and a separation layer arranged between the auxiliary substrate and the donor substrate, the separation layer having a support structure and sacrificial material, which is formed laterally between elements of the support structure;
- separating the auxiliary substrate from the donor substrate, including a selective removal of the sacrificial material in relation to the support structure.
A wafer composite, comprising:
- a donor substrate;
- an auxiliary substrate;
- and
- a separation layer connecting the auxiliary substrate to the donor substrate, the separation layer having a support structure and sacrificial material which is formed laterally between elements of the support structure.
Dependencies are inferred from the claim text.