Substrate processing apparatus and substrate removing method
AssigneeTokyo Electron Limited
InventorYasuhiro Tobe
Life of this patent
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Abstract
A substrate processing apparatus is provided. The substrate processing apparatus includes: an electro-static chuck configured to retain a substrate on a platform by electrostatic attraction; an ionized gas generation unit configured to ionize a pressure-controlled gas to generate an ionized gas; a gas supplying path, which is made of insulating material or to whose inner surface insulating processing is applied, configured to allow passage of the generated ionized gas; a gas supplying tube configured to supply the ionized gas that has passed the gas supplying path to a gap between the substrate and the electro-static chuck; and a gas exhaust path, which is provided inside the platform, configured to exhaust the gas that has been supplied to the gap.
Claims12
A substrate processing apparatus comprising:
- an electro-static chuck configured to retain a substrate on a platform by electro-static attraction;
- an ionized gas generation unit configured to generate an ionized gas by ionizing a pressure-controlled gas;
- a gas supplying path, which is made of insulating material or to whose inner surface insulating treatment is applied, configured to allow passage of the generated ionized gas;
- a gas supplying pipe configured to supply the ionized gas that has passed the gas supplying path to a gap between the substrate and the electro-static chuck;
- and
- a gas exhaust path, which is provided inside the platform, configured to exhaust the gas that has been supplied to the gap, wherein
- an ICP coil is wound on an insulating material in the ionized gas generation unit.
A substrate removing method of removing a substrate on a platform from an electro-static chuck that retains the substrate by electrostatic attraction, the substrate removing method comprising:
- generating an ionized gas by ionizing a pressure-controlled gas by using an ionized gas generation unit;
- allowing the generated ionized gas to pass through a gas supplying path, the gas supplying path being made of insulating material or insulating treatment being applied to an inner surface of the gas supplying path;
- supplying the ionized gas that has passed through the gas supplying path to a gap between the substrate and the electro-static chuck;
- exhausting the gas that has been supplied to the gap through a gas exhaust path provided inside the platform;
- and
- removing the substrate on the platform from the electro-static chuck, wherein
- an ICP coil is wound on an insulating material in the generating the ionized gas.
Dependencies are inferred from the claim text.