Apparatus and method for cleaning a back surface of a substrate

A substrate processing apparatus comprising:

• a back-surface polishing section configured to polish a back surface of a substrate;
• and
• a back surface cleaning apparatus configured to clean the back surface of the substrate which has been polished by the back-surface polishing section, the back surface cleaning apparatus including:
• a plurality of back-surface cleaning units each configured to clean the back surface of the substrate;
• a first substrate station configured to temporarily house the substrate whose back surface has been cleaned;
• a second substrate station configured to temporarily house the substrate whose back surface has not yet been cleaned;
• and
• a first transfer robot configured to transport the substrate, whose back surface has not yet been cleaned, from the second substrate station to one of the plurality of back-surface cleaning units and to transport the substrate, whose back surface has been cleaned, from one of the plurality of back-surface cleaning units to the first substrate station,
• wherein each of the back-surface cleaning units includes:
• a substrate holder configured to rotate the substrate while holding the substrate with the back surface facing upward;
• a scrub cleaning tool configured to be rotatable;
• a two-fluid nozzle disposed above the substrate holder;
• and
• a housing defining a cleaning chamber in which the substrate holder, the scrub cleaning tool, and the two-fluid nozzle are located.