US 10,651,053 B2 · Embedded metal insulator metal structure

Abstract

The present disclosure describes a method of forming a metal insulator metal (MIM) decoupling capacitor that can be integrated (or embedded) into a 3D integrated circuit package such as, for example, a chip-on-wafer-on-substrate (CoWoS) chip package or an integrated fan-out (InFO) chip package. For example, the method includes providing a glass carrier with a protective layer over the glass carrier. The method also includes forming a capacitor on the protective layer by: forming a bottom metal layer on a portion of the protective layer; forming one or more first metal contacts and a second metal contact on the bottom metal layer, where the one or more first metal contacts have a width larger than the second metal contact; forming a dielectric layer on the one or more first metal contacts; and forming a top metal layer on the dielectric layer.

Claims20

Dependent claims

A method of forming an interposer structure, the method comprising:

providing a carrier substrate with a protective layer thereon;
and
forming a capacitor on the protective layer, wherein the forming the capacitor comprises:
depositing a bottom metal layer on a portion of the protective layer, wherein the bottom metal layer comprises a redistribution layer;
depositing a photoresist layer over the bottom metal layer;
etching the photoresist layer to form through interposer via (TIV) openings in the photoresist, wherein the TIV openings expose respective portions of the bottom metal layer;
depositing a metal stack in the TIV openings to form TIVs;
removing the photoresist layer;
disposing a molding compound between and in physical contact with each of the TIVs;
depositing a dielectric layer on the molding compound and the TIVs, wherein the dielectric layer is spaced apart from the bottom metal layer;
and
depositing a top metal layer on the dielectric layer to form the capacitor.

9 more elements

Dependencies are inferred from the claim text.

Embedded metal insulator metal structure

Life of this patent

Embedded metal insulator metal structure

Life of this patent

Abstract

Claims20