Variable depth edge ring for etch uniformity control
AssigneeLam Research Corporation
InventorsIvelin Angelov, Cristian Siladie, Dean Larson, Brian Severson
Life of this patent
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Abstract
A substrate support includes an inner portion arranged to support a substrate, an edge ring surrounding the inner portion, and a controller that calculates a desired pocket depth of the substrate support. Pocket depth corresponds to a distance between an upper surface of the edge ring and an upper surface of the substrate. Based on the desired pocket depth, the controller selectively controls an actuator to raise and lower at least one of the edge ring and the inner portion to adjust the distance between the upper surface of the edge ring and the upper surface of the substrate.
Claims10
A substrate support, comprising:
- an inner portion arranged to support a substrate;
- an edge ring surrounding the inner portion;
- and
- a controller configured to
- calculate a desired pocket depth of the substrate support using data indicative of a relationship between the desired pocket depth and at least one process parameter, wherein the desired pocket depth corresponds to a desired distance between an upper surface of the edge ring and an upper surface of the substrate, and
- based on the desired pocket depth as calculated, selectively control an actuator to raise and lower at least one of the edge ring and the inner portion to adjust the distance between the upper surface of the edge ring and the upper surface of the substrate.
Dependencies are inferred from the claim text.