US 10,650,975 B2Granted

Multilayer electronic component

AssigneeSamsung Electro-Mechanics Co., Ltd.

InventorBeom Joon Cho

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Abstract

A multilayer electronic component includes: a first frame terminal including a first side frame, a first bottom frame and a first top frame; a second frame terminal including a second side frame, a second bottom frame and a second top frame; an electronic component including first and second external electrodes, and disposed between the first and second side frames; a first conductive adhesive disposed between the first external electrode and an upper portion of the first frame terminal; and a second conductive adhesive disposed between the second external electrode and an upper portion of the second frame terminal, wherein space portions are provided between the first and second external electrodes and lower portions of the first and second side frames and between the first and second external electrodes and the first and second bottom frames, respectively.

Claims9

Dependent claims

A multilayer electronic component comprising:

a first frame terminal including a first side frame extending in a first direction, a first bottom frame extending in a second direction and from a lower end of the first side frame, and a first top frame extending in the second direction and from an upper end of the first side frame;
a second frame terminal including a second side frame facing the first side frame and extending in the first direction, a second bottom frame extending in a third direction opposite to the second direction and from a lower end of the second side frame, and a second top frame extending in the third direction and from an upper end of the second side frame;
an electronic component including a first external electrode and a second external electrode disposed on opposing ends of the electronic component, respectively, and disposed between the first and second side frames;
a first conductive adhesive disposed between the first external electrode and an upper portion of the first side frame and between the first external electrode and the first top frame;
a second conductive adhesive disposed between the second external electrode and an upper portion of the second side frame and between the second external electrode and the second top frame;
and
a sealing part entirely enclosing the electronic component,
wherein space portions are provided between the first and second external electrodes and lower portions of the first and second side frames and between the first and second external electrodes and the first and second bottom frames, respectively, and
wherein a portion of the first conductive adhesive is arranged between the first side frame and a first side surface of the sealing part adjacent to the first side frame, so as to be exposed externally, and
wherein a portion of the second conductive adhesive is arranged between the second side frame and a second side surface of the sealing part adjacent to the second side frame, so as to be exposed externally.

7 more elements

A multilayer electronic component comprising:

a first frame terminal including a first side frame extending in a first direction, a first bottom frame extending in a second direction and from a lower end of the first side frame, and a first top frame extending in the second direction and from an upper end of the first side frame;
a second frame terminal including a second side frame facing the first side frame and extending in the first direction, a second bottom frame extending in a third direction opposite to the second direction and from a lower end of the second side frame, and a second top frame extending in the third direction and from an upper end of the second side frame;
an electronic component including a first external electrode and a second external electrode disposed on opposing ends of the electronic component, and disposed between the first and second side frames;
first and second conductive adhesives respectively disposed between the first top frame and the first external electrode and between the second top frame and the second external electrode;
and
a sealing part disposed to entirely enclose the electronic component and portions of the first and second top frames,
wherein space portions are provided between the sealing part and the first and second side frames and between the sealing part and the first and second bottom frames,
wherein a portion of the first conductive adhesive is arranged between the first side frame and a first side surface of the sealing part adjacent to the first side frame, so as to be exposed externally, and
wherein a portion of the second conductive adhesive is arranged between the second side frame and a second side surface of the sealing part adjacent to the second side frame, so as to be exposed externally.

6 more elements

Dependencies are inferred from the claim text.