Coil electronic component

A coil electronic component, comprising:

• a body portion including a coil layer and a reinforcing layer disposed on at least one of an upper portion or a lower portion of the coil layer,
• wherein the coil layer includes an insulating layer, a coil pattern, and a first conductive via,
• the reinforcing layer has a higher content of a ceramic filler than the insulating layer,
• the reinforcing layer has a higher degree of rigidity than the insulating layer,
• the reinforcing layer is free of a portion of the coil layer, and
• the first conductive via includes a metal layer disposed on the coil pattern and an intermetallic compound disposed on the metal layer such that a side surface of the metal layer directly contacts the insulating layer.

A coil electronic component comprising:

• a body portion including a plurality of coil layers laminated in a stacking direction, and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the laminated stack of coil layer,
• wherein each respective coil layer includes an insulating layer, a coil pattern, and a first conductive via penetrating through the insulating layer and disposed in the respective coil layer in a position which does not overlap with a position of other first conductive vias included in coil layers adjacent to the respective coil layer in the stacking direction,
• the reinforcing layer is free of a portion of the plurality of coil layers, and
• at least one of the first conductive vias includes a metal layer disposed on the coil pattern and an intermetallic compound disposed on the metal layer such that a side surface of the metal layer directly contacts the insulating layer.