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US 10,650,957 B1Granted
Additive deposition low temperature curable magnetic interconnecting layer for power components integration
AssigneeTexas Instruments Incorporated
InventorsYi Yan, Luu Thanh Nguyen, Ashok Prabhu, Anindya Poddar
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Abstract
Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.
Claims23
An apparatus, comprising:
- a lamination structure, including a patterned conductive feature that forms a part of a passive electronic component;
- a core structure;
- and
- a magnetic adhesive layer that joins the core structure to the lamination structure.
1 more element
A method, comprising:
- performing an inkjet printing process that prints a magnetic ink epoxy on a magnetic core structure, or on a lamination structure;
- and
- attaching the magnetic core structure to the lamination structure via the magnetic ink epoxy.
A method, comprising:
- formulating a magnetic ink epoxy with ferrite powders of different particle sizes;
- performing an inkjet printing process that prints the magnetic ink epoxy on a magnetic core structure;
- and
- attaching the magnetic core structure to a side of a lamination structure via the magnetic ink epoxy.
1 more element
A semiconductor product, comprising:
- a semiconductor die;
- and
- a magnetic apparatus, including:
- a lamination structure, including a patterned conductive feature that forms a part of a passive electronic component,
- a core structure, and
- a magnetic adhesive layer that joins the core structure to the lamination structure.
3 more elements
A method for fabricating a semiconductor product, comprising:
- performing an inkjet printing process that prints a magnetic ink epoxy on a magnetic core structure, or on a lamination structure;
- attaching the magnetic core structure to the lamination structure via the magnetic ink epoxy;
- electrically interconnecting conductive features of a semiconductor die, and conductive features of the magnetic lamination structure;
- and
- enclosing the lamination structure and the magnetic core structure in a package structure.
2 more elements
Dependencies are inferred from the claim text.