Laminated electronic component

A laminated electronic component comprising:

• an element body formed by laminating a plurality of element-body layers in a first direction;
• a pair of conductors formed by laminating a plurality of conductor layers in the first direction, the conductor layers being in direct contact with each other, wherein
• the pair of conductors is provided on the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction,
• the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors at a cross section orthogonal to the first direction,
• the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors at a cross section along the first direction,
• the number of conductor layers having uneven portions at the cross section orthogonal to the first direction among the plurality of conductor layers is equivalent to the total number of the plurality of conductor layers, and
• each uneven portion in each of the conductor layers includes protrusions having a height and depressions having a depth in a cross-section containing the conductor layers perpendicular to the first direction, and wherein the height and depth are different from one conductor layer to an adjacent conductor layer of the conductor layers, and the protrusions and depressions are offset from one conductor layer to an adjacent conductor layer of the conductor layers.