Spatial location of vias in a printed circuit board

A Printed Circuit Board (PCB) having a layout structure with rows and columns of vias, the PCB comprising:

• a plurality of groups of first via structures having first heights laid out in rows and columns, wherein each via structure of the plurality of groups of first via structures is a Via In-Pad Plated Over (VIPPO);
• and
• a plurality of second via structures having second heights, laid out in rows and columns, wherein an upper portion of each second via structure of the plurality of second via structures has a conductive pad thereon, and a distance between two groups of first via structures of the plurality of groups of first via structures includes at least two rows or two columns.

A method of fabricating a printed circuit board (PCB) to be aligned with a Ball Grid Array (BGA) package, the method comprising:

• laying out a plurality of victim vias arranged in the PCB, wherein each victim via of the plurality of victim vias is a Via In-Pad Plated Over (VIPPO);
• and
• laying out at least one aggressor via arranged in the PCB having a transition with at least one victim via of the plurality of victim vias, wherein the transition is a space in the PCB between a victim via and the at least one aggressor via along a row direction or a column direction, and the victim via is not positioned next to more than one transition, wherein a BGA is mounted on the PCB and the BGA has a configurable pinout before designing the PCB.