Conductive substrate and method for fabricating conductive substrate

A method for fabricating a conductive substrate, comprising:

• a transparent base material preparation process that prepares a transparent base material;
• and
• a laminated body formation process that forms a laminated body on at least one surface of the transparent base material;
• an etching process that forms an electrode pattern by etching the laminated body,
• wherein the laminated body formation process includes
• a copper layer formation step that forms a copper layer by a copper layer formation part that stacks copper, and
• a blackened layer formation step that forms a blackened layer by a blackened layer formation part that stacks a blacked layer containing oxygen, copper, and nickel,
• wherein the blackened layer formation step is carried out under a reduce pressure atmosphere, and a ratio of the nickel is 11 mass % or more and 60 mass % or less among the copper and the nickel contained in the blackened layer, and
• wherein the etching process etches the copper layer and the blacked layer of the laminated substrate, and forms the electrode pattern including a metal thin electrode, which is a laminated body having a copper electrode layer and a blackened electrode layer, and an opening portion is formed by the etching process in the copper layer and the blackened layer, and
• wherein a bottom width (W2) of the metal thin electrode and a pattern width (W1) of the metal thin electrode satisfy a relationship of formula (1):
• (W1−W2)/2W1≤0.075.