Back to results
US 10,649,503 B2Granted
Device comprising compressed thermal interface material (TIM) and electromagnetic (EMI) shield comprising flexible portion
AssigneeQUALCOMM Incorporated
InventorsVivek Sahu, Mehdi Saeidi
Life of this patent
Estimating the term…
Abstract
A device that includes a die, a thermal interface material (TIM) coupled to the die, and an electromagnetic (EMI) shield coupled to the thermal interface material (TIM). The electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM). The electromagnetic (EMI) shield comprises a flexible portion. In some implementations, the thermal interface material (TIM) is compressed by the electromagnetic (EMI) shield such that the thickness of the thermal interface material (TIM) is reduced by about at least 10˜20 percent.
Claims21
A device comprising:
- a die;
- a thermal interface material (TIM) provided over the die;
- an electromagnetic (EMI) shield coupled to the thermal interface material (TIM),
- wherein the electromagnetic (EMI) shield is configured to be coupled to ground,
- wherein the electromagnetic (EMI) shield comprises a first portion and a collapsible portion,
- wherein the collapsible portion includes the same material as the first portion, the collapsible portion is a vertical flexible portion configured to flex vertically,
- wherein the electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM), and
- a board coupled to the electromagnetic (EMI) shield through a solder.
5 more elements
An apparatus comprising:
- a die;
- a thermal interface material (TIM) provided over the die;
- means for electromagnetic (EMI) shielding directly coupled to the thermal interface material (TIM), the means for electromagnetic (EMI) shielding comprising a flexible portion,
- wherein the means for electromagnetic (EMI) shielding is configured to be coupled to ground,
- wherein the means for electromagnetic (EMI) shielding is configured to directly compress the thermal interface material (TIM),
- wherein the flexible portion comprises a vertical flexible portion that is configured to flex vertically, and
- a board coupled to the means for electromagnetic (EMI) shielding through a solder.
4 more elements
A device comprising:
- a die;
- a thermal interface material (TIM) provided over the die;
- an electromagnetic (EMI) shield coupled to the thermal interface material (TIM),
- wherein the electromagnetic (EMI) shield is configured to be coupled to ground,
- wherein the electromagnetic (EMI) shield comprises a first portion and a flexible portion,
- wherein the first portion and the flexible portion are contiguous,
- wherein the flexible portion includes a collapsible portion,
- wherein the first portion is coupled to the thermal interface material (TIM) and the flexible portion is located laterally to a side of the die,
- wherein the flexible portion comprises a stiffness in a range of about 40,000-180,000 Newtons/meter (N/m),
- wherein the flexible portion comprises a vertical flexible portion that is configured to flex vertically, the vertical flexible portion is perpendicular to the first portion and parallel to the die through an entire vertical length of the die,
- wherein the electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM);
- and
- a board coupled to the electromagnetic (EMI) shield through a solder interconnect.
10 more elements
Dependencies are inferred from the claim text.