Adaptive processes for improving integrity of surfaces
AssigneeApple Inc.
InventorsWilliam F. Leggett, Simon Regis Louis Lancaster-Larocque
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AssigneeApple Inc.
InventorsWilliam F. Leggett, Simon Regis Louis Lancaster-Larocque
Estimating the term…
A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structured such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.
A method for assembling a housing for an electronic device by using a first housing part and a second housing part, the first housing part including a metal substrate having an exterior surface and machined into the metal substrate is (i) an opening in the exterior surface, and (ii) walls that extend from the opening and terminate at a bottom surface, the method comprising:
An enclosure for an electronic device, the enclosure comprising:
A non-transitory computer readable storage medium storing instructions that, when executed by a processor of a computing device, cause the computing device to execute steps for assembling a housing for an electronic device from a first housing part and a second housing part, the first housing part including a metal substrate having an exterior surface, the exterior surface having (i) an opening machined into the metal substrate, and (ii) walls that extend from the opening and terminate a bottom surface, wherein the steps include:
Dependencies are inferred from the claim text.