Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers

A system operable to pattern a wafer, comprising:

• a measurement tool operable to perform measurements on the wafer, wherein results of the measurements comprise stress metrology data;
• one or more processors operable to:
• model deformation of the wafer based on the results of the measurements;
• and
• alter one or more parameters of a patterning process based on the deformation of the wafer;
• and
• a patterning tool operable to pattern the wafer using the patterning process after the one or more parameters of the patterning process have been altered to produce a first patterned wafer, wherein the one or more processors are further operable to model the deformation by estimating the deformation the wafer will have when the wafer is placed on a stage of the patterning tool by modeling how the deformation of the wafer interacts with the stage of the patterning tool.