Stepped wafer and method for manufacturing stepped wafer
AssigneeMitsubishi Electric Corporation
InventorNaoyuki Takeda
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Abstract
The present invention has an object of providing a stepped wafer that can prevent a resist from remaining after development, and a method for manufacturing the stepped wafer. The stepped wafer according to the present invention is a stepped wafer having a step and whose main surface is thinner in a center portion and is thicker in an outer periphery. The step includes a curved surface with a radius of curvature ranging from 300 μm to 1800 μm.
Claims7
A stepped wafer having a step and a main surface, wherein the stepped wafer is thinner in a center portion and is thicker in an outer periphery,
- wherein said step includes a curved surface with a radius of curvature in cross-section ranging from 300 μm to 1800 μm.
A method for manufacturing a stepped wafer having a step and a main surface, wherein the stepped wafer is thinner in a center portion and is thicker in an outer periphery, said method comprising
- (a) forming said step including a curved surface with a radius of curvature in cross-section ranging from 300 μm to 1800 μm.
Dependencies are inferred from the claim text.