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US 10,649,335 B2Granted
Substrate processing apparatus, substrate processing method and storage medium
AssigneeTokyo Electron Limited
InventorsTeruhiko Kodama, Masashi Enomoto, Masahide Tadokoro, Takafumi Hashimoto
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Abstract
A substrate processing method, includes acquiring a height distribution along a radial direction of a substrate in a peripheral edge portion of a front surface of the substrate, forming an underlayer film on the entire front surface of the substrate so as to correct a drop of a height of the peripheral edge portion based on the height distribution, and forming a resist film on the entire surface of the underlayer film.
Claims14
A substrate processing method, comprising:
- acquiring a height distribution along a radial direction of a substrate in a peripheral edge portion of a front surface of the substrate;
- forming an underlayer film on the entire front surface of the substrate so as to correct a drop of a height of the peripheral edge portion based on the height distribution;
- and
- forming a resist film on the entire surface of the underlayer film.
1 more element
A substrate processing apparatus, comprising:
- a height distribution acquisition module configured to acquire a height distribution along a radial direction of a substrate in a peripheral edge portion of a front surface of the substrate;
- and
- an underlayer film forming module configured to form an underlayer film, which is provided under a resist film, on the entire front surface of the substrate so as to correct a drop of a height of the peripheral edge portion based on the height distribution.
Dependencies are inferred from the claim text.