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US 10,649,329 B2Granted
Active light sensitive or radiation sensitive resin composition, active light sensitive or radiation sensitive film, pattern forming method, method for manufacturing electronic device, and electronic device
AssigneeFUJIFILM Corporation
InventorsShohei Kataoka, Akinori Shibuya, Keiyu Ou
Life of this patent
Estimating the term…
Abstract
An active-light-sensitive or radiation-sensitive resin composition includes a basic compound (A) corresponding to at least one of the following basic compound (A1) or (A2): (A1) a nonionic compound having an alicyclic structure (a1) and a basic site (b2) at a site different from the alicyclic structure within one molecule, or (A2) a nonionic compound having a heterocyclic structure (a2) having no basicity and a basic site (b2) at a site different from the heterocyclic structure within one molecule.
Claims17
An active-light-sensitive or radiation-sensitive resin composition comprising
- a basic compound (A) that is represented by the following General Formula (I),
- an acid generator (B), and
- a resin (P) having a group that decomposes by the action of an acid to generate a polar group,
- W-L-RN (I)
- in General Formula (I),
- RN represents a basic site,
- L represents a single bond or a divalent linking group, and
- W represents a bridged alicyclic group having 7 to 15 carbon atoms, the bridged alicyclic group including a polar group, W represents a heterocyclic ring having 6 to 20 carbon atoms, or W represents a monovalent group formed by removing a hydrogen atom from the structure of anthraquinone.
5 more elements
Dependencies are inferred from the claim text.