Semiconductor chip package having optical interface

A semiconductor package comprising:

• a chip having a first surface;
• a mold having a first surface and a second surface configured to encapsulate the chip;
• a conduction structure electrically connecting the first surface and the second surface of the mold;
• an optical device arranged on the first surface of the mold to be electrically connected to the conduction structure;
• a wiring pattern configured to electrically connect the conduction structure and a pad formed on the first surface of the chip, and perform electrical connection in the semiconductor package;
• an external connection terminal configured to electrically connect the semiconductor package to the outside;
• and
• an optical-cable fixing member configured to fix an optical cable which transmits an optical signal to the optical device from the outside of the semiconductor package or transmits an optical signal to the outside of the semiconductor package from the optical device.