Optical sensing device having integrated optics and methods of manufacturing the same
AssigneeAvago Technologies International Sales Pte. Limited
InventorsGim Hong Koh, Ramana Murty, Ching Kean Chia
Life of this patent
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Abstract
The present disclosure provides a communication system, a sensing device, and a semiconductor device, among other things. One example of the disclosed sensing device includes a semiconductor die having a photodetector, an optical element optically coupled to and disposed on the photodetector, at least one support structure substantially surrounding the optical element, and a top metal portion disposed on the semiconductor die adjacent to but distanced away from the optical element and the at least one support structure.
Claims20
A sensing device for detecting light, the sensing device comprising:
- a semiconductor die having a photodetector, wherein the photodetector includes an exposed area on a surface of the semiconductor die;
- a substantially transparent material coupled to and disposed on the photodetector, wherein the substantially transparent material provides a light guide function and is physically supported by a support structure, wherein the substantially transparent material directs light incident on a light-receiving surface of the substantially transparent material towards the exposed area of the photodetector, wherein the support structure is at least partially overlapping an area of the semiconductor die other than the photodetector, and wherein a void area exists between a base of the support structure and a bottom surface of the substantially transparent material;
- and
- a top metal pad disposed on the semiconductor die adjacent to but distanced away from the substantially transparent material.
An optical system, comprising:
- an optical sensing device configured to convert light signal into an electrical signal, the optical sensing device comprising:
- a substrate having a light detection area provided thereon, the light detection area having a top surface that is coincident with a top surface of the substrate;
- a light guide system that includes an optical element and a support structure, wherein the optical element is configured to carry the light signal to the light detection area, wherein the support structure physically supports the optical element and is positioned at least partially outside the light detection area, and wherein a void area exists between a base of the support structure and a bottom surface of the optical element;
- and
- a top metal pad disposed on the top surface of the substrate that is adjacent to but distanced away from the light guide system.
An optical sensing device, comprising:
- a semiconductor die having a top surface, wherein a photodetector is provided in the semiconductor die and has a light-receiving surface that is substantially co-planar with the top surface of the semiconductor die;
- an optical element positioned substantially co-axially with respect to the photodetector, wherein the optical element comprises a top surface and an opposing bottom surface that is positioned proximate to the photodetector, wherein light incident on the top surface of the optical element is guided to the bottom surface of the optical element so that the light can be provided to the photodetector, and wherein the top surface of the optical element comprises an area that is larger than the bottom surface of the optical element;
- one or more support structures that are physically supported by the top surface of the semiconductor die or a metal trace formed thereon, wherein the one or more support structures are positioned beyond the photodetector and provide structural support for the optical element, and wherein a void exists between a base of the one or more support structures and a bottom surface of the optical element;
- and
- a metal pad formed on the top surface of the semiconductor die, wherein the metal pad is distanced away from the optical element.
Dependencies are inferred from the claim text.