Pressure sensor device and manufacturing method thereof

A pressure sensor device comprising:

• a substrate comprising a first through-hole and a second through-hole;
• a pressure sensor chip mounted on the substrate to cover the first through-hole in such a manner that a bottom surface thereof is exposed to the air through the first through-hole, in order to measure a pressure of a fluid relative to a pressure of the air;
• a barrier bonded to a top surface of the substrate to protect the pressure sensor chip and to define an inner space;
• an upper housing bonded onto the barrier to protect at least a part of the pressure sensor chip, and comprising an air inlet and a fluid inlet provided in different directions;
• and
• a lower housing bonded to a bottom surface of the substrate to protect the pressure sensor chip and to provide a passage in which the air flowing in through the air inlet sequentially passes through the second through-hole and the first through-hole.

A pressure sensor device comprising:

• a substrate comprising a first through-hole and a second through-hole;
• a housing surrounding at least a part of the substrate to provide the first and second through-holes therein, and comprising a first surface in which a fluid inlet is provided and a second surface in which an air inlet is provided and which is different from the first surface;
• and
• a pressure sensor chip mounted on the substrate in order to measure a pressure of a fluid, which is applied to the fluid inlet, relative to a pressure of the air, which is applied to the air inlet,
• wherein the housing comprises a first inner region connected to the fluid inlet to receive the pressure of the fluid, and a second inner region connected to the air inlet to receive the pressure of the air and divided from the first inner region by an inner wall on the substrate between the first and second through-holes, and
• wherein the pressure sensor chip is mounted on the first through-hole such that a surface thereof is provided in the first inner region and another surface thereof receives the pressure of the air of the second inner region through the first through-hole.

A method of manufacturing a pressure sensor device, the method comprising:

• preparing a substrate comprising two or more through-holes through which the air passes;
• mounting a pressure sensor chip on the substrate to cover the through-hole in such a manner that a bottom surface of the pressure sensor chip is exposed to the air through the through-hole, in order to measure a pressure of a fluid relative to a pressure of the air;
• providing an integrated circuit (IC) chip on the substrate;
• providing a barrier having a contact with the substrate and defining an inner space, to protect the pressure sensor chip and the IC chip;
• providing a pressure transmission medium encapsulating at least parts of the pressure sensor chip and the IC chip, in the inner space;
• providing a lower housing on a bottom surface of the substrate to protect the pressure sensor chip exposed by the through-hole;
• and
• providing an upper housing comprising an air inlet and a fluid inlet provided in different directions, on the barrier.