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US 10,648,640 B2Granted
Light emitting diode (LED) pad mount system
AssigneeValeo North America, Inc.
InventorsJulien Hemon, Fred Roth
Life of this patent
Estimating the term…
Abstract
A lighting assembly includes a heat sink including a pad surface, and an LED mounted on the pad surface. An optical device is optically coupled to the LED, and a support structure is provided for connecting the optical device to the heat sink. The support structure includes fixation spacers to connect the supporting structure to the heat sink, and both the LED and the fixation spacers contact the pad surface on a common plane.
Claims19
A lighting assembly, comprising:
- a heat sink comprising a raised flat pad, the raised flat pad protruding from a flat portion of the heat sink;
- an LED mounted on the raised flat pad, the LED being in direct contact with the raised flat pad;
- an optical device optically coupled to the LED;
- and
- a support structure for connecting the optical device to the heat sink, wherein the support structure comprises fixation spacers to connect the support structure to the heat sink, and both the LED and the fixation spacers rest on the raised flat pad on a common plane,
- wherein:
- the support structure further comprises at least one touch down peg,
- the heat sink further comprises a corresponding touch down hole for each of the at least one touch down peg, and
- the corresponding touch down hole is positioned on a surface of the heat sink that is noncoplanar relative to the raised flat pad.
6 more elements
A method for assembling a lighting assembly, comprising:
- forming a heat sink with a raised flat pad by stamping a blank, the raised flat pad protruding from a flat portion of the heat sink;
- connecting an LED to the raised flat pad;
- joining an optical device and a support structure;
- connecting the support structure to the raised flat pad of the heat sink, the LED and the support structure resting on the raised flat pad, the LED and the support structure being in direct contact with the raised flat pad;
- connecting a PCB to the heat sink, the PCB resting on the heat sink at a location other than the raised flat pad, the PCB and the raised flat pad being positioned side by side in the heatsink:
- connecting the PCB electrically to the LED by at least one ribbon wire;
- positioning the optical device relative to the LED, the LED able to direct light into a first end of the optical device and out a second end of the optical device;
- and
- aligning the support structure with the heat sink by inserting at least one touch down peg of the support structure into a corresponding at least one touch down hole of the heat sink positioned on the flat portion adjacent the raised flat pad.
6 more elements
Dependencies are inferred from the claim text.