Silicon wafer
AssigneeGlobalwafers Japan Co., Ltd.
InventorsSusumu Maeda, Hironori Banba, Haruo Sudo, Hideyuki Okamura, Koji Araki, Koji Sueoka, Kozo Nakamura
Life of this patent
Estimating the term…
Loading patent…
AssigneeGlobalwafers Japan Co., Ltd.
InventorsSusumu Maeda, Hironori Banba, Haruo Sudo, Hideyuki Okamura, Koji Araki, Koji Sueoka, Kozo Nakamura
Estimating the term…
A silicon wafer includes a denuded zone which is a surface layer and of which the density of vacancy-oxygen complexes which are complexes of vacancies and oxygen is less than 1.0×1012/cm3. An intermediate layer is disposed inwardly of the denuded zone so as to be adjacent to the denuded zone. The density of the vacancy-oxygen complexes in the intermediate layer increases gradually inwardly in the depth direction from the boundary with the denuded zone within a range of 1.0×1012/cm3 or over and less than 5.0×1012/cm3. The intermediate layer has a depth determined corresponding to the depth of the denuded zone. A bulk layer is disposed inwardly of the intermediate layer so as to be adjacent to the intermediate layer. The density of the vacancy-oxygen complexes in the bulk layer is 5.0×1012/cm3 or over.
A silicon wafer comprising:
A silicon wafer comprising:
A silicon wafer comprising:
Dependencies are inferred from the claim text.