Full-area counter-flow heat exchange substrate support
AssigneeApplied Materials, Inc.
InventorJohn M. White
Life of this patent
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AssigneeApplied Materials, Inc.
InventorJohn M. White
Estimating the term…
Embodiments described herein generally relate to a temperature control system in a substrate support assembly. In one embodiment, a substrate support assembly is disclosed. The substrate support assembly includes a support plate assembly The support plate assembly includes a first fluid supply manifold, a second fluid supply manifold, a first fluid return manifold, a second fluid return manifold, a plurality of first fluid passages, a plurality of second fluid passages, and a fluid supply conduit. The plurality of first fluid passages extend from the first fluid supply manifold to the first fluid return manifold. The plurality of second fluid passages extend from the second fluid supply manifold to the second fluid return manifold. The plurality of fluid passages extend across an upper surface of the support plate assembly in an alternating manner. The fluid supply conduit is configured to supply a fluid to the fluid supply manifolds.
A substrate support assembly, comprising:
A processing chamber, comprising:
A substrate support assembly, comprising:
Dependencies are inferred from the claim text.