Cleaning method and film deposition apparatus executing the cleaning method for uniformly cleaning rotary table
AssigneeTokyo Electron Limited
InventorsTatsuya Tamura, Takahito Umehara
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Abstract
A method performed by a film deposition apparatus including a process chamber and a rotary table that is disposed in the process chamber and includes a substrate-mounting surface on which a substrate is placeable. The method includes a first cleaning process of supplying a cleaning gas from above the substrate-mounting surface of the rotary table while rotating the rotary table in a first cleaning position, and a second cleaning process of supplying the cleaning gas from above the substrate-mounting surface of the rotary table while rotating the rotary table in a second cleaning position that is lower than the first cleaning position.
Claims8
A method performed by a film deposition apparatus including a process chamber and a rotary table that is disposed in the process chamber and includes a substrate-mounting surface on which a substrate is placeable, the method comprising:
- a first cleaning process of supplying a cleaning gas from above the substrate-mounting surface of the rotary table while rotating the rotary table in a first cleaning position;
- and
- a second cleaning process of supplying the cleaning gas from above the substrate-mounting surface of the rotary table while rotating the rotary table in a second cleaning position that is lower than the first cleaning position, wherein
- in the first cleaning process, the cleaning gas is supplied for a first time period;
- in the second cleaning process, the cleaning gas is supplied for a second time period;
- and
- a ratio between the first time period and the second time period is determined based on a ratio between a thickness of a deposit on an upper surface of the rotary table and a thickness of the deposit on a side surface or a lower surface of the rotary table.
Dependencies are inferred from the claim text.