Heat-curable fluoropolyether-based adhesive composition and electric/electronic component

A heat-curable fluoropolyether-based adhesive composition comprising:

• (A) 100 parts by mass of a linear polyfluoro compound having at least two alkenyl groups in one molecule, and a perfluoropolyether structure in a main chain;
• (B) an alicyclic epoxy group-free and fluorine-containing organohydrogensiloxane having in one molecule:
• a monovalent perfluoroalkyl or perfluorooxyalkyl group(s), or a divalent perfluoroalkylene or perfluorooxyalkylene group(s);
• and at least two silicon atom-bonded hydrogen atoms (SiH groups), the component (B) being in an amount at which the SiH groups therein are in an amount of 0.3 to 3 mol per 1 mol of the alkenyl groups in the component (A);
• (C) an alicyclic epoxy group-containing and fluorine-containing organohydrogensiloxane having in one molecule:
• a monovalent perfluoroalkyl or perfluorooxyalkyl group(s), or a divalent perfluoroalkylene or perfluorooxyalkylene group(s);
• and at least two silicon atom-bonded hydrogen atoms (SiH groups), the component (C) being in an amount at which the SiH groups therein are in an amount of 0.01 to 2 mol per 1 mol of the alkenyl groups in the component (A);
• and
• (D) a platinum group metal-based catalyst, the component (D) being in an amount of 0.1 to 2,000 ppm in terms of mass of platinum group metal atoms with respect to the component (A).