Loading patent…
AssigneesMitsubishi Heavy Industries, Ltd., Akita University, Tsuchiya Co., Ltd.
InventorsToshiyuki Takayanagi, Naomoto Ishikawa, Hideki Horizono, Nobuyuki Kamihara, Mikio Muraoka, Hiroaki Hayashi, Osamu Yoshida, Kotaro Tsuji
Estimating the term…
Provided is an adhesive that can provide quick bonding between thermoplastic resins and excellent bond strength, a structure having adhesion provided by the adhesive, and an adhesion method using the adhesive. The adhesive bonds a first member (11) containing a thermoplastic resin or a carbon fiber reinforced thermoplastic resin and a second member (12) containing the thermoplastic resin or the carbon fiber reinforced thermoplastic resin. The adhesive includes a thermoplastic resin as a main component containing a metal nano material that absorbs electromagnetic waves and generates heat.
An adhesive for bonding between a first member containing a thermoplastic resin or a carbon fiber reinforced thermoplastic resin and a second member containing the thermoplastic resin or the carbon fiber reinforced thermoplastic resin, the adhesive comprising:
Dependencies are inferred from the claim text.