Thermoplastic compositions for electronics or telecommunication applications and shaped article therefore
AssigneeSabic Global Technologies B.V.
InventorsJian Wang, Shijie Song, Zhenke Wei, Qin Wang, Mian Dai
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AssigneeSabic Global Technologies B.V.
InventorsJian Wang, Shijie Song, Zhenke Wei, Qin Wang, Mian Dai
Estimating the term…
A thermoplastic composition includes from about 50 wt. % to about 90 wt. % of a polymeric base resin and from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component. The low Dk/low Df glass fiber component has a Dk of less than about 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.002 at a frequency of from 1 MHz to 1 GHz. In certain aspects the thermoplastic composition has a Dk that is at least about 0.1 lower than a substantially identical reference composition that does not include the low Dk/low Df glass fiber component.
A thermoplastic composition comprising:
A method for making a thermoplastic article, comprising:
Dependencies are inferred from the claim text.