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US 10,647,487 B2Granted
Multilayer structure, method for producing same, packaging material and product including same, and protective sheet for electronic device
AssigneeKurray Co., Ltd.
InventorsRyoichi Sasaki, Yasutaka Inubushi, Masahiko Ota, Yasushi Morihara, Masakazu Nakaya
Life of this patent
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Abstract
The present invention relates to a multilayer structure including a base (X), a layer (Y), and a layer (Z), wherein the layer (Y) contains an aluminum-containing compound (A), and the layer (Z) contains an organic phosphorus compound (BO) and a polymer (F) having an ether bond and having no glycosidic bond.
Claims20
A multilayer structure, comprising a base (X), a layer (Y), and a layer (Z), wherein:
- the layer (Y) comprises an aluminum-containing compound (A);
- and
- the layer (Z) comprises an organic phosphorus compound (BO) and a polymer (F) having an ether bond and having no glycosidic bond,
- wherein the aluminum-containing compound (A) is a compound (Ab) comprising a reaction product (D) formed by a reaction between an aluminum-containing metal oxide (Aa) and an inorganic phosphorus compound (BI).
1 more element
Dependencies are inferred from the claim text.