Fluid level sensor
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Michael W. Cumbie, Anthony D. Studer
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Abstract
A method of forming a fluid level sensor includes coupling an array of heating elements and sensors to a first side of a substrate. A second side of the substrate is coupled to a carrier. The method also includes coupling an electrical interface to the carrier and electrically coupling the array to the electrical interface via a conductive wire. The method further includes overmolding the electrical interface, the first side of the substrate, and the conductive wire to form an overmolded fluid level sensor. The carrier may be coupled to the second side of the substrate and the electrical interface via a releasable adhesive and may be removed after overmolding the fluid level sensor.
Claims20
A method of forming a fluid level sensor comprising:
- coupling an array of heating elements and sensors to a first side of a substrate, wherein each heating element is independently actuatable to emit heat independent of other heating elements;
- coupling a second side of the substrate to a carrier;
- coupling an electrical interface to the carrier;
- thinning the substrate to no more than 100 micrometers in thickness;
- electrically coupling the array to the electrical interface via a conductive wire;
- and
- overmolding the electrical interface, the first side of the substrate, and the conductive wire to form an overmolded fluid level sensor.
A fluid level sensor comprising:
- a substrate, wherein the substrate is approximately 100 micrometers (μm) thick or less, wherein thinning the substrate increases performance of the sensors on the substrate;
- an array of heating elements and sensors coupled to a first side of the substrate;
- an electrical interface;
- a wire bond electronically coupling the array to the electrical interface;
- and
- an overmold, the overmold covering the electrical interface, the first side of the substrate, and the wire bond to form an overmolded fluid level sensor.
A printable fluid reservoir comprising:
- a fluid level sensor comprising:
- a substrate;
- an array of heating elements and sensors coupled to a first side of the substrate, wherein each heating element is independently actuatable to emit heat independent of other heating elements;
- and
- an overmold, the overmold covering the first side of the substrate to form an overmolded fluid level sensor;
- and
- a controller to independently actuate the heating elements.
Dependencies are inferred from the claim text.